SEOUL, Jan. 28 (Korea Bizwire) – Samsung Electronics Co., the world’s biggest memory chip maker, has created a new research lab in the United States to focus on developing next-generation three-dimensional (3D) DRAM, industry sources said Sunday.
The new lab is operating under Device Solutions America (DSA) headquartered in Silicon Valley, which oversees Samsung’s semiconductor production in the U.S., and will work to develop an upgraded DRAM model to allow Samsung to lead the global 3D memory chip market, according to the sources.
In October, the South Korean tech giant said it is preparing new 3D structures for sub-10-nanometer DRAM, allowing larger single-chip capacities that can exceed 100 gigabits.
Samsung succeeded in commercializing 3D vertical NAND flash memory chips for the first time in the industry in 2013.
(Yonhap)
Post Disclaimer
The information provided in our posts or blogs are for educational and informative purposes only. We do not guarantee the accuracy, completeness or suitability of the information. We do not provide financial or investment advice. Readers should always seek professional advice before making any financial or investment decisions based on the information provided in our content. We will not be held responsible for any losses, damages or consequences that may arise from relying on the information provided in our content.
